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Stencil designs that preclude solder paste from entering the PTH also result in a significant reduction of solder paste on the top surface and in the PTH. These reductions may make the pin-in-paste technique impractical for some boards. If the solder volume is too low, the available solder distributes unevenly around the PTH pin and the PTH barrel, resulting in voids and inferior solder joints (see Fig. 47.18a, b). A normal incident x-ray will highlight circumferential voids in PTHs, as evidenced in Fig. 47.19. 47.3.11.3 Pin-in-Paste on Thick Boards. Since the solder volume increases proportionately with increasing board thickness, pin-in-paste soldering is best suited for thin PWBs ( 1.6 mm). The technique is limited by available solder and required solder volume for proper barrel fill. There are two ways to deal with the added volume.

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FIGURE 47.19 A normal incident x-ray photo of a connector. The light spots around the pins are areas of no solder or voids (reduced solder thickness). (Courtesy of Hewlett-Packard).

K[l - (Td/T)s] 7s + 1 - K(hs + 1) [l + (T&)s](Ts + 1)

FIGURE 47.20 Application of solder pre-form foil washer to augment pin-in-paste solder volume. Note that the flux from the solder paste is sufficient for pre-form soldering.

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473114 Addition of Solder through Pre-Forms Solder foil pre-forms (stamped solder foil) can be added to through-hole parts to augment solder volume (see Fig 4720) This approach is expensive and application of the pre-forms is tedious and time-consuming 473115 Buried Intrusive Method There is a new method for formation of a somewhat nonstandard solder joint in thick PWBs2 A foreshortened pin, on the order of that used for a board 16 mm in thickness, is used in the thick board So, too, solder volume is treated as if for a board 16 mm thick When the solder melts, it coalesces and wets to the pin and barrel as in any through-hole soldering process Conventional thinking would have the molten solder running through the barrel and out the bottom side of the board.

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the flow measurement of stream A (the wild stream) is used to compute the set point for the flow of stream B so that the desired ratio of components will be obtained. The Smith predictor control scheme (dead-time compensation) was developed to improve the control of a system having a large transport lag. The method is based on a model of the process that is first-order with dead time. By introducing inner loops that contain elements of the transfer function of the model, the control system is transformed ideally to one without transport lag, a system that is much easier to control. This ideal situation occurs when the process and the model are in exact agreement. In reality, the success of the Smith predictor strategy depends on the degree of agreement between process and model. Internal model control resembles the Smith predictor strategy in terms of the structure of the block diagram. To apply the IMC method, one must have an accurate model of the process, the model uncertainty, the type of disturbance (step, ramp, etc.) and the performance objective (integral of square error). The method, which is based on a rigorous mathematical foundation, leads to an IMC controller that is the best that can be designed in terms of the performance objective. The IMC structure can be reduced to a conventional control structure in which the conventional controller is related to the IMC controller and the parameters of the model. For many simple processes with simple disturbance (impulse, step, etc.), the equivalent conventional controller based on the IMC design method turns out to be the equivalent of a PID controller.

Instead, nearly all the solder is retained by surface tension forces around pin and barrel If the solder volume is calculated properly and aptly delivered, there is 100 percent pin wetting both longitudinally and circumferentially (see Fig 4721) Accelerated thermal cycling followed by tensile testing has shown that resultant solder-joint reliability is sufficient and equivalent to conventionally formed pinin-paste or wave-soldered joints of twice the pin-wetted length 473116 Temperature Compatibility If pin-in-paste soldering is to be used, check that components are temperature-compatible with the oven reflow process The high temperatures and long exposures associated with oven reflow soldering may cause unsuited molded component bodies to melt or warp Connector contact normal force may be affected if the molded connector body softens or distorts.

Solder joints or wire bonds internal to some devices may become disbanded, and some, such as electrolytic capacitors, may leak or even explode as a result of an oven reflow cycle Check the component manufacturer s specification for thermal limits and compatibility with oven reflow soldering..

does not change when a disturbance in Ci occurs. Would there be any problem in implementing this Gf (b) If Gf is to be a lead-lag transfer function

FIGURE 47.21 Cross-sectional micrograph showing pin-in-paste buried intrusive soldering. Note that very little solder has drained.

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