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Once the predominant method for mass assembly of circuit boards, wave soldering has taken a back seat to oven-based reflow soldering. The ease of surface mounting led to a rapid rise in popularity of oven-based technology, and proliferation of surface-mountable packages has led to a decreased reliance on wave soldering. Nonetheless, through-hole componentry persists and mixed-mount (surface-mount plus through-hole) technology still may be the only alternative for some assemblies, and it is unlikely that wave soldering will disappear from PWB manufacturing in the short term. Since wave soldering, compared to reflow soldering, is fraught with defects, it behooves the designer and assembler to minimize the number of PTH components on a board.

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The peak-to-peak amplitude of stem position is H less than A. Then the gain due to hysteresis is stem amplitude over signal amplitude:

FIGURE PM-1

Wave-Solder Process Basics Wave soldering utilizes a reservoir of molten solder pumped and circulated to form a standing wave. The circuit board is prepared with devices for wave soldering in one of three ways:

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Coarse-pitch surface-mount components, especially passive devices, are affixed to the bottom side of the PWB using surface-mount adhesive. The adhesive is cured prior to wave soldering. The adhesive is in contact with the body of the component, which is aligned with its respective pads on the circuit board in preparation for wave soldering. Solder-tailed components such as connectors, PGAs, or other through-hole devices are inserted into PTHs from the top side of the board. Solder-tailed components such as axially leaded devices are inserted from the top side of the circuit board, whereas the leads are clinched on the bottom side of the board.

The circuit board is placed on a motorized, edge-hold conveyor where it is fluxed, then preheated both to activate the flux and give the PWB a thermal boost.The board is next skimmed over the crest of the molten solder wave. Only the bottom of the circuit board is exposed to the molten solder (see Fig. 47.22).

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determine Tt and T2 by the Foxboro rule. How do you determine whether lead or lag is to predominate Use t,, = 1 .O in the Foxboro rule. (c) When feedforward-feedback control is present, sketch the response C(t) when Ci = l/s and when Gf from part (a) is used. (d) Repeat (c) when Gf from part (b) is used. Only a rough sketch that suggests the transient response is expected in this case. (e) Determine C(t) when Ci = l/s, and Gf = - 1, and the feedback loop is broken at AA. Obtain the numerical value of C(t) at t = 0.5,1.0, and 1.5.

FIGURE 47.22 Schematic of a board going over a solder wave.The board is conveyed over the pumped standing wave of molten solder. Only the secondary side of the board is exposed to the wave. The wave height is set to contact the bottom of the board very slightly.

When exposed to the wave, the adhesive-attached surface-mount devices pick up solder on their metal contacts and the solder bridges from the contact to its corresponding bonding pad on the bottom side of the PWB. In the case of solder-tail components, the molten solder is drawn by capillary action between the lead and the PTH barrel. If the barrel and lead are hot enough and well fluxed, the solder fills up the barrel and wick to form fillets from pin to barrel. As the board continues past the wave, it cools, solder solidifies, and joint formation is complete. One attribute of this process is the speed at which solder joints are formed. Much quicker than oven reflow soldering, the wave-solder process allows little time for preheating, fluxing, and solder-joint formation, which also explains the variability of this process.

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